ASML

We’re honored to be ranked among the world’s 50 most valuable companies based on market cap for the year 2023.

We would not be where we are today without our commitment to innovation, which is the guiding force that connects and unites our employees, suppliers and customers 🤝

New generations of devices need new generations of chips. Chipmakers build more functionality and performance on silicon, while mass production keeps these chips affordable. The industry's innovation fuels this cycle – and our High NA EUV technology is part of its future: http://ms.spr.ly/6042iaznr

Whereas EUV lithography harnesses extreme ultraviolet light to enable 13 nanometer resolution, our High NA EUV boosts resolution further to 8 nanometer. To do that, we re-engineered the optics. 'Anamorphic' optics increase numerical aperture from 0.33 to 0.55, enabling sharper imaging with the same light.

With High NA EUV, chipmakers will be able to print features 1.7x smaller and achieve transistor densities 2.9x higher than those possible today. This will improve performance, functionality and energy efficiency of electronics, while also helping to reduce the process complexity of manufacturing advanced chips to improve cost efficiency.

More and more leading-edge chips have their first few critical layers printed using our EUV systems, while their higher layers are printed with our DUV systems.

Overlay – how well the layers of a microchip are aligned – is crucial and must be ever more precise. Learn how we collaborated with long-time partner ZEISS Semiconductor Manufacturing Technology to develop an improved lens-adjustment system that enhances overlay to help make the production of state-of-the-art chips a reality: